By James J. Licari
"I suggest this e-book with no reservation to all people in electronics who needs to comprehend adhesives, or make judgements approximately adhesives, or both." - George Riley
, Pages vii-viii
, Pages ix-x
1 - Introduction
, Pages 1-37
2 - features and idea of Adhesives
, Pages 39-94
3 - Chemistry, formula, and houses of Adhesives
, Pages 95-168
4 - Adhesive Bonding Processes
, Pages 169-260
5 - Applications
, Pages 261-346
6 - Reliability
, Pages 347-391
7 - try out and Inspection Methods
, Pages 393-430
, Pages 431-439
, Pages 441-457
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"I suggest this ebook with out reservation to every person in electronics who needs to comprehend adhesives, or make judgements approximately adhesives, or either. " - George RileyContent: Preface, Pages vii-viiiAcknowledgements, Pages ix-x1 - advent, Pages 1-372 - features and idea of Adhesives, Pages 39-943 - Chemistry, formula, and houses of Adhesives, Pages 95-1684 - Adhesive Bonding methods, Pages 169-2605 - functions, Pages 261-3466 - Reliability, Pages 347-3917 - attempt and Inspection equipment, Pages 393-430Appendix, Pages 431-439Index, Pages 441-457
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Additional resources for Adhesives Technology for Electronic Applications. Materials, Processes, Reliability
Failures due to corrosion, metal migration, and outgassing initially gave organic materials a bad name. At the same time, the government and industry saw the need to use polymer adhesives because of their low cost, low processing temperatures, and ease of rework. During the next decade, with improvements made in purifying resins, reducing the amounts of ionic contaminants, and defining the requirements for qualification, polymer adhesives began to be accepted. Although metallurgical methods are still widely used today, in the drive toward lower costs, higher densities, and further miniaturization, polymer adhesives have displaced them in many applications.
Oct. � Rich, R. , Anaerobic Adhesives, Handbook of Adhesive Technology, (A. Pizzi and K. L. � Design Guidelines For Use of Adhesives and Organic Coatings in Hybrid Microcircuits, NASA Technical Memorandum TM X-64908, (Dec. � Marshall Space Flight Center Drawing MSFC 16A02053. � Licari, J. , Weigand, B. , and Soykin, C. , Development of a Qualification Standard for Adhesives Used in Hybrid Microcircuits, NASA CR-161978 (Dec. � Kraus, H. , Chip Adhesives Update, Solid State Technol. (Mar. � Ebel, G.
Hybrid Microelect. � Licari, J. , Materials and Processes for Microwave Hybrids, ISHM Monograph, Intl. Soc. Hybrid Microelect. � Harper, C. , and Sampson, R. � Lau, J. � Wong, C. , Engineering Surfaces in Ceramic Pin Grid Array Packaging to Inhibit Epoxy Bleeding, HewlettPackard J. (Aug. , Chip-Scale Packaging Meets Future Design Needs, Solid State Technol. (Apr. � Bauer, C. , Lets Talk Chip Scale, Circuits Assembly, IPC Supplement (Apr. � Ngulty, T. , and Ekere, N. , Chip Scale vs Flip Chip: Issues to Consider, Circuits Assembly (Nov.
Adhesives Technology for Electronic Applications. Materials, Processes, Reliability by James J. Licari